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L6210
Dual Schottky diode bridge
Features

Monolithic array of eight Schottky diodes High efficiency 4 A peak current Low forward voltage Fast recovery Time two separated diode bridges
Description
The L6210 is a monolithic IC containing eight Schottky diodes arranged as two separated diode bridges. This diodes connection makes this device versatile in many applications. They are used particular in bipolar stepper motor applications, where high efficient operation, due to low forward voltage drop and fast reverse recovery time, are required. Table 1. Device summary
Order code E-L6210 Package PDIP 16 Packing Tube PDIP 16
The L6210 is available in a 16 pin powerdip package (12 + 2 + 2) designed for the 0 to 70C ambient temperature range.
April 2008
Rev 2
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www.st.com 8
Contents
L6210
Contents
1 2 Block and pin connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 2.2 2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 4 5
Mounting instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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L6210
Block and pin connection diagram
1
Block and pin connection diagram
Figure 1. Block diagram
Figure 2.
Pin connection (top view)
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Electrical specifications
L6210
2
2.1
Electrical specifications
Absolute maximum ratings
Table 2.
Symbol IF VR TAMB TSTG
Absolute maximum ratings
Parameter Repetitive Forward Current Peak Peak Reverse Voltage (per diode) Operating Ambient Temperature Storage Temperature Range Value 2 50 70 -55 to +150 Unit A V C C
2.2
Thermal data
Table 3.
Symbol RTH J-CASE RTH J-AMB
Thermal data
Parameter Thermal Impedance Junction-case Thermal Impedance Junction-ambient without External Heatsink Min. Typ. Max. 14 65 Unit C/W C/W
2.3
Electrical characteristics
Table 4.
Symbol
Electrical characteristics (TJ = 25C unless otherwise specified)
Parameter Test conditions IF = 100 mA Min. Typ. 0.65 0.8 1 Max. 0.8 1 1.2 1 Unit V V V mA
VF
Forward Voltage Drop
IF = 500 mA IF = 1 A
IL
Leakage Current
VR = 40 V, TAMB = 25 C
Note:
At forward currents of greater than 1 A, a parasitic current of approximately 10 mA may be collected by adiacent diodes.
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L6210
Mounting instructions
3
Mounting instructions
The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4). During soldering the pin temperature must not exceed 260C and the soldering time must not be longer then 12 s. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 3. Example of PC board copper area which is used as heatsink
Figure 4.
Example of an external heatsink
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Package information
L6210
4
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. PDIP 16 mechanical data and package dimensions
mm DIM. MIN. A A1 A2 b b2 c D(*) E E1(*) e e1 eA eB L 2.920 3.300 0.380 2.920 0.360 1.140 0.200 3.300 0.460 1.520 0.250 TYP. MAX. 5.330 0.0150 4.950 0.1150 0.1299 0.1949 0.560 0.0142 0.0181 0.0220 1.780 0.0449 0.0598 0.0701 0.360 0.0079 0.0098 0.0142 MIN. TYP. MAX. 0.2098 inch
OUTLINE AND MECHANICAL DATA
18.670 19.180 19.690 0.7350 0.7551 0.7752 7.620 6.100 7.870 6.350 2.540 17.780 7.620 10.920 8.260 0.3000 0.3098 0.3252 7.110 0.2402 0.2500 0.2799 0.1000 0.7000 0.3000 0.4299
3.810 0.1150 0.1299 0.1500
PDIP 16
(*)"D" and "E1" dimensions do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.25mm.
0015895_E
0015895 E
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L6210
Revision history
5
Revision history
Table 5.
Date 31-Jul-2003 23-Apr-2008
Document revision history
Revision 1 2 Initial release. Package information updated. Changes
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L6210
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